Surface mounted led package

ABSTRACT

An LED device and LED module are provided. The LED device is coupled to a lead frame with a first plane and a second plane opposite to the first plane, the lead frame having a LED chip disposed on the first plane. The LED device includes a reflection cup structure disposed on the lead frame, a lens structure and at least one fixing structure. The LED chip is disposed in the reflection cup structure and electrically connected to the first plane of the lead frame. The lens structure covers the first plane and the second plane of the lead frame. The fixing structure and the fixing structures are formed integrally and cover the lead frame cooperatively.

CROSS REFERENCE TO RELATED APPLICATION

This application is a Continuation of co-pending application Ser. No.12/543,483, filed on Aug. 18, 2009, the entire contents of which arehereby incorporated by reference and for which priority is claimed under35 U.S.C. §120.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an LED structure with a thermoplastictransparent material lens, in which LED chips and the wire thereon maybe protected from damage caused by direct scouring of thermoplastictransparent material.

2. Description of the Prior Art

In recent years, light emitting diodes (LEDs) have begun to play animportant role as a light source in a backlight of an LCD panel. Thus,physical characteristics and packaging processes of the LED need to befurther improved for meeting various application needs. For example,disposing or forming the condensing lens on an LED chip is popularlyused for increasing the light density or the visual angle variation ofthe LED.

In general, the said condensing lens is made of silicone material.However, in an LED lens forming process, the slow flow of the meltedsilicone material in a mold is resulted in a long process time forforming the LED lens.

In addition, if the said disposal of the condensing lens above the LEDchip is utilized, an additional assembly step may be needed in an LEDpackaging process. Thus, not only may the LED packaging process be morecomplicated, but manufacturing cost of the LED may also be increased.Thus, how to reduce cost and time needed for forming the LED lens may bea concern in an LED packaging process design.

SUMMARY OF THE INVENTION

The present invention provides a method for manufacturing an LED lensstructure, especially on using an injection molding process for forminga lens structure covering the LED chip.

The present invention further provides an LED device comprising an LEDlens structure according to the abovementioned manufacturing method.

Furthermore, the present invention provides an LED module having aplurality of lens structures formed above a plurality of LED chipsrespectively and a plurality of fixing structures used for fixing theplurality of lens structures on a lead frame or a plurality ofreflective cups by receiving thermoplastic transparent material from agate of a mold using an injection molding process.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partial cross-sectional diagram of an LED module accordingto a first preferred embodiment of the present invention.

FIG. 2 is a flowchart of a method for forming the LED module accordingto the first preferred embodiment of the present invention.

FIG. 3 is a partial diagram of a lead frame in FIG. 1.

FIG. 4 is a partial diagram of reflection cup structures being formed onthe lead frame in FIG. 3.

FIG. 5 is a partial cross-sectional diagram of LED chips beingrespectively installed within the reflection cup structures in FIG. 4.

FIG. 6 is a partial cross-sectional diagram of glue layers being formedin the reflection cup structures in FIG. 5.

FIG. 7 is a partial cross-sectional diagram of the lead frame in FIG. 6with the plurality of LED chips being disposed in a mold.

FIG. 8 is a partial cross-sectional diagram of lens structures andfixing structures being formed in the mold in FIG. 7.

FIG. 9 is a partial cross-sectional diagram of the lens structures andthe fixing structures covering the lead frame, the reflection cupstructures, and the LED chips cooperatively.

FIG. 10 is a partial cross-sectional diagram of the LED module accordingto a second preferred embodiment of the present invention.

FIG. 11 is a flowchart of a method for forming an LED module accordingto the second preferred embodiment of the present invention.

FIG. 12 is a partial diagram of a lead frame in FIG. 10.

FIG. 13 is a partial diagram of reflection cup structures being formedon the lead frame in FIG. 12.

FIG. 14 is a partial cross-sectional diagram of the reflection cupstructures in FIG. 13 along the cross-sectional line 14-14′.

FIG. 15 is a partial cross-sectional diagram of LED chips beingrespectively installed within the reflection cup structures in FIG. 14.

FIG. 16 is a partial cross-sectional diagram of glue layers beingrespectively formed in the reflection cup structures in FIG. 15.

FIG. 17 is a partial cross-sectional diagram of the lead frame in FIG.16 being disposed in a mold.

FIG. 18 is a partial cross-sectional diagram of lens structures andfixing structures being formed in the mold in FIG. 17.

FIG. 19 is a partial cross-sectional diagram of the lens structurescovering the LED chips.

FIG. 20 is a partial cross-sectional diagram of the LED device accordingto a third preferred embodiment of the present invention.

DETAILED DESCRIPTION

Methods for forming an LED lens structure and related structuresprovided by the present invention may be applied to an LED light bar andone single LED. At first, an LED light bar with a plurality of LEDs istaken as an example for detailed description of manufacturing methodsand structural designs mentioned in the present invention.

Please refer to FIG. 1, which is a partial cross-sectional diagram of anLED module 10 according to a first preferred embodiment of the presentinvention. The LED module 10 includes a lead frame 12, a plurality ofreflection cup structures 14, a plurality of LED chips 16, a pluralityof glue layers 18, a plurality of lens structures 20, and a plurality offixing structures 21. After the LED module 10 is formed by an injectionmolding process, the lens structures 20 and the fixing structures 21cover the lead frame 12 so that the lens structures 20 and the fixingstructures 21 may be fixed to the lead frame 12 together.

Briefly, as shown in FIG. 8, a mold 24 as shown in FIG. 7 may beutilized to form the lens structure 20 on the glue layer 18 and form thefixing structure 21 between two adjacent reflection cup structures 14,so that the lens structure 20 and the fixing structure 21 may cover thelead frame 12 cooperatively. In other words, the plurality of lensstructures 20 and the plurality of fixing structures 21 are utilized tocover the plurality of reflection cup structures 14, the plurality ofglue layers 18, and the lead frame 12. It should be noted thatthermoplastic transparent material (i.e. material for forming the lensstructures 20) needs to be injected to a reverse plane of the lead frame12 (a plane without the LED chips 16) in the present invention. In sucha manner, the lens structures 20 may be accordingly formed above the LEDchips 16 without additional installation. Furthermore, the LED chips 16and the related circuits (such as wire thereon) may also be protectedfrom damage caused by the related lens molding process.

For increasing brightness of light generated by the LED chips 16, theplurality of reflection cup structures 14 is disposed on the lead frame12. As shown in FIG. 1, each reflection cup structure 14 is disposed ata distance from each other on the lead frame 12. The plurality of LEDchips 16 is respectively disposed in the plurality of reflection cupstructures 14 and is electrically connected to a first plane 22 of thelead frame 12. The plurality of glue layers 18 is respectively formed inthe plurality of reflection structures 14 and respectively covers theplurality of LED chips 16. The plurality of glue layers 18 is preferablymade of epoxy or silicone material. The glue layers 18 may be omissibleparts in the LED module 10. More detailed description for the LED module10 is provided as follows.

Please refer to FIG. 2 and FIG. 3. FIG. 2 is a flowchart of a method forforming the LED module 10 according to the first preferred embodiment ofthe present invention. FIG. 3 is a partial diagram of the lead frame 12in FIG. 1. The method involves packaging the plurality of LED chips 16on the lead frame 12 and then respectively forming the plurality of lensstructures 20 on the plurality of glue layers 18. The lead frame 12mentioned in Step 200 is depicted in FIG. 3. The lead frame 12 is usedto connect the plurality of LED chips 16 to an external circuit boardfor performing subsequent operations of the plurality of LED chips 16,such as light emitting control of the plurality of LED chips 56 or powersupply for the plurality of LED chips 56. A method for forming the leadframe 12 can be a chemical etching method or a mechanical punchingmethod. The chemical etching method involves utilizing a mask to form acorresponding pattern on lead frame material (e.g. copper alloy,iron-nickel alloy, etc.) and then utilizing an etching process to formthe lead frame 12. The mechanical punching method involves utilizing amold to perform a punching process on a metal board for forming the leadframe 12. In the present invention, the forming process of the leadframe 12 is preferably a mechanical punching process.

Next, please refer to FIG. 2 and FIG. 4 which is a partial diagram ofthe plurality of reflection cup structures 14 being formed on the leadframe in FIG. 3. In the LED module 10, the reflection cup structure 14disposed around the LED chip 16 may reflect incident light for adjustingemitting angle of the LED chip 16 and increasing light intensity of theLED chip 16. As shown in FIG. 4, after the lead frame 12 is formed by amechanical punching process, the plurality of reflection cup structures14 is formed around the lead frame 12 by an injection molding process.The forming principle of the injection molding process is described asfollows. The injection molding process involves adding a fixed quantityof plastic particles into a feeding funnel periodically and then sendingthe plastic particles into a heating pipe so as to melt the plasticparticles. Subsequently, a piston is utilized to push the melted plasticparticles to pass through a nozzle and then inject them into a moldthrough the nozzle. After the mold is filled with the melted plasticparticles, a cooling system is utilized to solidify the melted plasticparticles so as to form a finished product. In summary, compared withthe transfer molding process, in which melted material flows slowly, theinjection molding process may utilize a piston to inject melted materialinto a mold so that time needed for forming a finished product may bereduced. As mentioned above, in the present invention, the first step isto dispose the lead frame 12 in a mold corresponding to the shape of theplurality of reflection cup structures 14. Subsequently, the pluralityof reflection cup structures 14 may be formed in the mold and associatedwith the lead frame 12 according to the said injection molding process.It should be mentioned that the formed reflection cup structures 14 maypartially cover the lead frame 12 so as to secure the plurality ofreflection cup structures 14 on the lead frame 12 more firmly.

Next, please refer to FIG. 2 and FIG. 5 which is a partialcross-sectional diagram of the plurality of LED chips 16 being installedwithin the plurality of reflection cup structures 14 respectively. Asshown in FIG. 5, after the plurality of reflection cup structures 14 isformed on the lead frame 12 by the said injection molding process, theplurality of LED chips 16 is installed within the plurality ofreflection cup structures 14 and onto the first plane 22 of the leadframe 12 respectively (Step 204). Furthermore, the method for installingthe plurality of LED chips 16 within the plurality of reflection cupstructures 14 also may include electrically connecting the plurality ofLED chips 16 and the first plane 22 of the lead frame 12 respectively bya wire bonding process, a flip-chip process, etc.

Next, please refer to FIG. 2 and FIG. 6 which is a partialcross-sectional diagram of the glue layers 18 being formed in thereflection cup structures 14 in FIG. 5. As shown in FIG. 6, theplurality of glue layers 18 is formed in the reflection cup structures14, respectively (Step 206). In other words, transparent material (e.g.epoxy, silicone, etc.) is injected into each reflection cup structure 14to form the corresponding glue layer 18 for packaging the LED chip 16 inthe reflection cup structure 14. Furthermore, in the said process ofinjecting the transparent material, fluorescent powder may also be mixedinto the transparent material for emitting light of specific wavelength.For example, YAG (Yttrium Aluminum Garnet, YAG) of fluorescent powdermay be excited by blue light emitted from an LED chip to generate whitelight.

Next, please refer to FIG. 2 and FIG. 7 which is a partialcross-sectional diagram of the lead frame 12 with the LED chips 16 inFIG. 6 being disposed in the mold 24. As shown in FIG. 7, the lead frame12 with the plurality of packaged LED chips 16 is disposed in the mold24 (Step 208).

Next, the subsequent step is to perform the injection molding process.Please refer to FIG. 2 and FIG. 8 which is a partial cross-sectionaldiagram of the lens structures 20 and the fixing structures 21 beingformed in the mold 24 in FIG. 7. As shown in FIG. 8, meltedthermoplastic transparent material is injected to the second plane 28 ofthe lead frame 12 via a gate 26 of the mold 24 to fill with the mold 24.Thus, the lens structure 20 is accordingly formed on the glue layer 18and the fixing structure 21 between adjacent reflection cup structures14 (Step 210). In other words, the lens structures 20 and the fixingstructures 21 are formed integrally and cover the lead frame 12cooperatively. Finally, after drawing out the lead frame 12 with thelens structures 20 from the mold 24, the manufacturing process of theLED module 10 is completed. In addition, as shown in FIG. 7 and FIG. 8,the second plane 28 is (but is not limited to) a bottom plane of thelead frame 12. In the present invention, the melted thermoplastictransparent material may also be injected to another plane of the leadframe 12 different from the first plane 22. Thus, the LED chips 16 andthe related circuits (such as wire thereon) may be protected from damagecaused by direct scouring of the thermoplastic transparent material. Inanother embodiment of the present invention, the location of the gate 26of the mold 24 may be changed to a side plane of the lead frame 12,which is located at a specific distance from the LED chips 16. Inaddition, the thermoplastic transparent material may also be injectedvia another injection gate opposite to the gate 26 of the mold 24. Theinjection gate needs to be close to the lead frame 12, and the distancebetween the injection gate and the first plane 22 of the lead frame 12needs to be less than that between the reflection cup structure 14 andthe first plane 22 of the lead frame 12. Furthermore, the thermoplastictransparent material mentioned in Step 212 is preferably polycarbonatematerial. As for the injection molding process mentioned in Step 210,the related description is omitted herein since it is similar to thatmentioned in Step 202.

It should be mentioned that Step 206 is an omissible step. Please referto FIG. 9, which is a partial cross-sectional diagram of the lensstructures 20 and the fixing structures 21 associating with the leadframe 12. In other words, the lens structures 20 and the fixingstructures 21 cover the lead frame 12, the reflection cup structures 14,and the LED chips 16. After the plurality of LED chips 16 is installedwithin the plurality of reflection cup structures 14 of the lead frame12 and onto the first plane 22 of the lead frame 12 respectively, thelead frame 12 with the plurality of LED chips 16 may be directlydisposed in the mold 24 without performing Step 206, and Step 210 isthen performed. In such a manner, as shown in FIG. 9, the plurality ofLED chips 16 may be packaged in the plurality of reflection cupstructures 14 of the lead frame 12 by the plurality of lens structures20 respectively instead of the plurality of glue layers 18, so that themanufacturing process of the LED module 10 may be simplified and therelated cost may also be reduced.

Next, please refer to FIG. 10, which is a partial cross-sectionaldiagram of an LED module 50 according to a second preferred embodimentof the present invention. The LED module 50 includes a lead frame 52, aplurality of reflection cup structures 54, a plurality of LED chips 56,a plurality of glue layers 58, a plurality of lens structures 60, and aplurality of fixing structures 61. After an injection molding process,the LED module 50 is formed and each fixing structure 61 may passthrough the lead frame 52 so as to secure the lens structures 60 to thelead frame 52. In the following, how the lens structures 60 and thefixing structures 61 associate with the lead frame 52 may be describedin detail by a mold 66 as shown in FIG. 17.

Briefly, as shown in FIG. 10, the mold 66 as shown in FIG. 17 isutilized to form the plurality of lens structures 60 and the pluralityof fixing structures 61 integrally. It should be noted thatthermoplastic transparent material (i.e. material for forming the lensstructures 60) needs to be injected to a reverse plane of the lead frame52 (a plane without the LED chips 56). In such a manner, the pluralityof lens structures 60 may be accordingly formed above the plurality ofLED chips 56 respectively without additional installation. Furthermore,the plurality of LED chips 56 and the related circuits (such as wirethereon) may also be protected from damage caused by the related lensmolding process.

For increasing brightness of light generated by the plurality of LEDchips 56, the plurality of reflection cup structures 54 is disposed onthe lead frame 52. The plurality of LED chips 56 is disposed in theplurality of reflection cup structures 54 respectively and iselectrically connected to the lead frame 52. The plurality of gluelayers 58 is respectively formed in the plurality of reflection cupstructures 54 and respectively covers the plurality of LED chips 56. Theplurality of glue layers 58 is preferably made of epoxy or siliconematerial. The glue layers 58 are omissible parts in the LED module 50.Next, more detailed description for the LED module 50 is provided asfollows.

Please refer to FIG. 11 and FIG. 12. FIG. 11 is a flowchart of a methodfor forming the LED module 50 according to the second preferredembodiment of the present invention. FIG. 12 is a partial diagram of thelead frame 52 in FIG. 10. The method involves packaging the plurality ofLED chips 56 on the lead frame 52 and then respectively forming theplurality of lens structures 60 on the plurality of glue layers 58. Thelead frame 52 mentioned in Step 1100 is depicted in FIG. 12. The leadframe 52 is used to connect the plurality of LED chips 56 to an externalcircuit board so that subsequent operations may be performed, such aslight emitting control of the plurality of LED chips 56 or power supplyfor the plurality of LED chips 56.

Next, please refer to FIG. 11 and FIG. 13 which is a partial diagram ofthe plurality of reflection cup structures 54 being formed on the leadframe 52 in FIG. 12. As shown in FIG. 13, after the lead frame 52 isformed by a mechanical punching process, the plurality of reflection cupstructures 54 may also surround the lead frame 52 by the aforementionedinjection molding process. For example, the lead frame 52 may bedisposed in a mold corresponding to the shape of the plurality ofreflection cup structures 54, and then the plurality of reflection cupstructures 54 may be formed in the mold and associated with the leadframe 52 according to the aforementioned injection molding process. Itshould be mentioned that the formed reflection cup structures 54 maypartially cover the lead frame 52 so as to secure the plurality ofreflection cup structures 54 on the lead frame 52 more firmly.

Next, please refer to FIG. 13 and FIG. 14 which is a partialcross-sectional diagram of the plurality of reflection cup structures 54in FIG. 13 along a cross-sectional line 14-14′. As shown in FIG. 13 andFIG. 14, a runner 64 is respectively formed at two sides of eachreflection cup structure 54. The plurality of runners 64 may be formedwithin the reflection cup structures 54 simultaneously when thereflection cup structures 54 are formed by the aforementioned injectionmolding process, or may be formed by a common drilling process after thereflection cup structures 54 are formed on the lead frame 52.Furthermore, as shown in FIG. 14, the diameter of a first end P.sub.1 ofeach runner 64 corresponding to a first plane 62 of the lead frame 52 isless than the diameter of a second end P.sub.2 of each runner 64corresponding to a second plane 70 of the lead frame 52, which is a socalled “sink hole” structural design. Thus, in the subsequent process offorming the lens structures 60 on the glue layers 58, the meltedthermoplastic transparent material may move along the said holestructure with different diameters in the runner 64 to form the fixingstructure 61 with different diameters. In such a manner, connection ofthe fixing structures 61 and the runners 64 of the reflection cupstructures 54 may cause connection of the lens structures 60 and thereflection cup structures 54 more firmly. In addition, the meltedthermoplastic transparent material may also be injected into the runner64 more easily by employing the large hole diameter design for thesecond end P.sub.2 of the runner 64. However, the internal hole diameterdesign of the runner 64 is not limited to the said “sink hole”structure. For example, the hole diameter of the runner 64 may also beuniform for saving manufacturing cost. As for which hole diameter designis utilized, it depends on practical manufacturing needs.

Next, please refer to FIG. 11 and FIG. 15 which is a partialcross-sectional diagram of the plurality of LED chips 56 beingrespectively installed within the reflection cup structures 54 in FIG.14. As shown in FIG. 15, after forming the plurality of reflection cupstructures 54 on the lead frame 52 by the said injection moldingprocess, the next step is to install the plurality of LED chips 56within the plurality of reflection cup structures 54 and onto the firstplane 62 of the lead frame 52 respectively (Step 1104). Similarly, themethod for installing the plurality of LED chips 56 within the pluralityof reflection cup structures 54 also may include electrically connectingthe plurality of LED chips 56 and the first plane 62 of the lead frame52 respectively by a wire bonding process, a flip-chip process, etc.

Next, please refer to FIG. 11 and FIG. 16 which is a partialcross-sectional diagram of the plurality of glue layers 58 beingrespectively formed in the reflection cup structures 54 in FIG. 15. Asshown in FIG. 16, transparent material (e.g. epoxy, silicone, etc.) isinjected into the plurality of reflection cup structures 54 to form theplurality of glue layers 58, so as to package the LED chips 56 disposedin the reflection cup structures 54 on the lead frame 52. As mentionedabove, in the process of injecting the transparent material, fluorescentpowder may also be mixed into the transparent material for emittinglight of specific wavelength. For example, YAG (Yttrium Aluminum Garnet,YAG) of fluorescent powder may excite by blue light emitted from an LEDchip to generate white light.

Next, please refer to FIG. 11 and FIG. 17 which is a partialcross-sectional diagram of the lead frame 52 in FIG. 16 being disposedin the mold 66. As shown in FIG. 17, the lead frame 52 with theplurality of packaged LED chips 56 is disposed in the mold 66, and thenthe injection molding process is performed.

Next, please refer to FIG. 11 and FIG. 18 which is a partialcross-sectional diagram of the lens structures 60 and the fixingstructures 61 being formed in the mold 66 in FIG. 17. As shown in FIG.18, the melted thermoplastic transparent material is injected to thesecond plane 70 of the lead frame 52 via a gate 68 of the mold 66 andthen into the runners 64 of the reflection cup structures 54. Thus, thecorresponding lens structures 60 may be formed on the glue layers 58respectively and the fixing structures 61 may be formed in the runners64 of the reflection cup structures 54 respectively. In a manner of thelens structures 60 being formed on the glue layers 58 and the fixingstructures 61 passing through the lead frame 52 and being formed in therunners 64 of the reflection cup structures 54, association of the lensstructures 60 and the reflection cup structures 54 may be more firm.Subsequently, the manufacturing process of the LED module 50 iscompleted after drawing out the lead frame 52 with lens structures 60from the mold 66. As shown in FIG. 18, the aforementioned second plane70 is (but is not limited to) a bottom surface of the lead frame 52. Asa result, the LED chips 56 and the related circuits (such as wirethereon) may be protected from damage caused by direct scouring of themelted thermoplastic transparent material. In addition, thethermoplastic transparent material used in the present invention ispreferably polycarbonate material. As for the injection molding processof the lens structure 60, the related description is omitted hereinsince it is similar to that of the lens structure 20.

Similarly, Step 1106 may also be an omissible step. Please refer to FIG.19, which is a partial cross-sectional diagram of the lens structure 60covering the LED chip 56. As shown in FIG. 19, after the plurality ofLED chips 56 is installed within the plurality of reflection cupstructures 54 and onto the first plane 62 of the lead frame 54respectively, the lead frame 54 with the plurality of LED chips 56 isdisposed in the mold 66 and a corresponding injection molding process isthen performed. In such a manner, as shown in FIG. 19, the plurality ofLED chips 56 may be packaged in the plurality of reflection cupstructures 54 of the lead frame 52 by the plurality of lens structures60 respectively instead of the plurality of glue layers 58, so that themanufacturing process of the LED module 50 may be simplified and themanufacturing cost of the LED module 50 may also be reduced.

Furthermore, as mentioned above, the lens structure forming methodmentioned in the aforementioned embodiments of the present invention mayalso be applied to, one single LED. For example, please refer to FIG.20, which is a partial side view of an LED device 100 according to athird preferred embodiment of the present invention As shown in FIG. 20,the LED device 100 includes a lead frame 102, a reflection cup structure104, an LED chip 106, a glue layer 108, and a lens structure 110. Thereflection cup structure 104 is formed around the lead frame 102. TheLED chip 106 is disposed within the reflection cup structure 104 and iselectrically connected to the lead frame 102. The glue layer 108 isformed in the reflection cup structure 104 and covers the LED chip 106.The lens structure 110 is formed on the glue layer 108. A fixingstructure 112 respectively located at two sides of the lens structure110 passes through the lead frame 102 and the reflection cup structure104 for fixing the lens structure 110 to the lead frame 102. There is anapplication difference between the third embodiment and the first andsecond embodiments. Compared with the first and second embodiments,which are applied to an LED light bar, the LED device 100 mentioned inthe third embodiment is preferably applied to an SMD (Surface MountedDevice) LED. As for the manufacturing process of the LED device 100, therelated description is omitted herein for simplicity since it is similarto the manufacturing processes mentioned in the first and the secondembodiments. In addition, the manufacturing principles mentioned in thefirst and the second embodiments may also be applied to the thirdembodiment, such as packaging an LED chip within a reflection cupstructure by a lens structure instead of a glue layer.

Furthermore, in the present invention, the structural design of the leadframe 12/52 is not limited to the structure as shown in FIGS. 3 and 12,meaning that it may vary with practical applications. For example, thelead frame 12/52 may also be changed to another structure, in which aplurality of lead frames is arranged side by side so that the pluralityof LED chips 16/56 may be electrically connected to each other in aseries/parallel connection manner. As a result, the plurality of LEDchips 16/56 may be capable of emitting light cooperatively in an arraymanner so as to produce a surface light source.

The present invention involves utilizing an injection molding process toinject thermoplastic transparent material into a place of a lead framethat no LED chip is directly mounted on to form a lens structure abovean LED chip. Furthermore, the present invention also utilizes a fixingstructure to pass through or to cover the lead frame for fixing theformed lens structure to the lead frame. In such a manner, not onlyprocess time for forming a lens structure may be reduced, but the lensstructure may also be formed above an LED chip without additionalinstallation. Furthermore, the LED chips and the wire thereon may alsobe protected from damage caused by the related lens molding process.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention.

1. An LED device, comprising: a lead frame with a first plane and asecond plane opposite to the first plane; a reflection cup structuredisposed on the lead frame; a LED chip disposed on the first plane ofthe lead frame, wherein the LED chip is disposed in the reflection cupstructure and electrically connected to the first plane of the leadframe; a lens structure, made of thermoplastic transparent materialcorresponding to the LED chip, covering the reflection cup structure andthe lead frame; and at least one fixing structure, made of thermoplastictransparent material and formed integrally with the lens structure,wherein the fixing structure is formed at a side of one of thereflection cup structure and the lead frame to retain at least one ofthe reflection cup structure and the lens structure fixedly to the leadframe.
 2. The LED device of claim 1 further comprising: a glue layerformed within the reflection cup structure and covering the LED chip. 3.The LED device of claim 2, wherein the glue layer is filled in thereflection cup and formed integrally with the lens structure.
 4. The LEDdevice of claim 1, wherein the fixing structure further comprises atleast one runner, wherein the runner is formed within the reflection cupstructure by receiving the thermoplastic transparent material injectedfrom a gate of a mold.
 5. The LED device of claim 4, wherein thediameter of a first end of the runner corresponding to the first planeof the lead frame is less than the diameter of a second end of therunner corresponding to the second plane of the lead frame.
 6. The LEDdevice of claim 1, wherein a pair of the fixing structures are extendedfrom two sides of the lens structure and disposed at two sides of thereflection cup, wherein the fixing structures and the lens structure areformed integrally and covering the lead frame cooperatively.
 7. The LEDdevice of claim 1, wherein the lens structure and the fixing structureare covering the bottom surface of the reflection cup and the firstplane and the second plane of the lead frame.
 8. An LED modulecomprising: a lead frame; a plurality of reflection cup structuresdisposed on a first plane of the lead frame, two adjacent reflection cupstructures being disposed at a specific distance on the lead frame; aplurality of LED chips disposed in the plurality of reflection cupstructures respectively and electrically connected to the lead frame; aplurality of lens structures formed above the plurality of LED chipsrespectively; and a plurality of fixing structures associated with thelead frame for fixing the plurality of lens structures on at least oneof the reflection cup structures and the lead frame, wherein theplurality of fixing structures and the plurality of lens structures aremade of a thermoplastic transparent material.
 9. The LED module of claim8, further comprising: a plurality of glue layers formed within theplurality of reflection cup structures respectively and covering theplurality of LED chips respectively.
 10. The LED module of claim 9,wherein the glue layers are filled in the reflection cups and formedintegrally with the lens structures and the fixing structures.
 11. TheLED module of claim 8, wherein the thermoplastic transparent materialinjected from a gate of a mold directly covers the plurality of LEDchips for packaging the plurality of LED chips on the lead frame. 12.The LED module of claim 8, wherein each fixing structure connects anytwo adjacent lens structures.
 13. The LED module of claim 8, furthercomprising: a plurality of runners formed within the plurality ofreflection cup structures, and the thermoplastic transparent material isinjected to a second plane of the lead frame opposite to the first planevia a corresponding gate of a corresponding mold and then into therunners to form the plurality of fixing structures.
 14. The LED moduleof claim 13, wherein the diameter of a first end of the runnercorresponding to the first plane of the lead frame is less than thediameter of a second end of the runner corresponding to the second planeof the lead frame.
 15. The LED module of claim 8, wherein a pair of thefixing structures are extended from two sides of the lens structure anddisposed at two sides of the reflection cup, wherein the fixingstructures and the lens structure are formed integrally and covering thelead frame cooperatively.
 16. The LED module of claim 8, wherein thelens structure and the fixing structure are covering the bottom surfaceof the reflection cup and the first plane and the second plane of thelead frame.